- Package Cooled :
- Power Dissipation @ Temperature Rise :
4 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,320
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.65" | 628 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized | |||
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1,760
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Square, Angled Fins | 1.750" (44.45mm) | 0.490" (12.44mm) | - | TO-220, TO-218 | Bolt On and Board Mounts | 1.750" (44.45mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.30°C/W | Black Anodized | |||
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3,290
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEAT SINK 1.75" HIGH RISE TO-220 | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 0.750" (19.05mm) | - | TO-220 | Clip and Board Mounts | 1.750" (44.45mm) | 4.0W @ 30°C | 2.00°C/W @ 400 LFM | 6.30°C/W | Black Anodized | |||
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1,575
Ships today + free overnight shipping
|
Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.65" | 628 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | - | Black Anodized |
