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7 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Natural | Material Finish | |
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3,611
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Ohmite | HEATSINK BLACK ANODIZED | CSM | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.472" (12.00mm) | 0.492" (12.50mm) | TO-220 | Solderable Feet | 1.228" (31.20mm) | 2.0W @ 44°C | 18.00°C/W | Black Anodized | |||
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2,034
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t-Global Technology | HEATSINK CER 12X12X10MM | - | Active | Ceramic | Heat Spreader | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | - | 0.394" (10.00mm) | - | - | - | |||
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3,180
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Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Bolt On | 0.500" (12.70mm) | - | 21.00°C/W | Black Anodized | |||
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3,944
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Assmann WSW Components | HEATSINK CPU XCUT | - | Active | Aluminum Alloy | Top Mount | Square, Pin Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.709" (18.00mm) | - | 27.00°C/W | Black Anodized | |||
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3,513
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t-Global Technology | HEATSINK CER 12X12X10MM W/TAPE | - | Active | Ceramic | Heat Spreader | Square, Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | Thermal Tape, Adhesive (Included) | 0.394" (10.00mm) | - | - | - | |||
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872
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t-Global Technology | CERAMIC HEATSINK | - | Active | Ceramic | Top Mount | Square, Pin Fins | 0.472" (12.00mm) | 0.472" (12.00mm) | - | Thermal Tape, Adhesive (Included) | 0.394" (10.00mm) | - | - | - | |||
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1,416
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DFRobot | RASPBERRY PI PURE COPPER HEATSIN | - | Active | Copper | Heat Spreader | Square | 0.472" (12.00mm) | 0.472" (12.00mm) | Raspberry Pi | Thermal Tape, Adhesive (Included) | 0.039" (1.00mm) | - | - | - |