- Manufacture :
- Series :
- Material :
- Type :
- Package Cooled :
- Thermal Resistance @ Forced Air Flow :
3 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,047
Ships today + free overnight shipping
|
Wakefield-Vette | ANCHOR HEATSINK 32X32X12MM | Wave 3x | Active | Aluminum Alloy | Board Level | Square, Angled Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | - | BGA | Clip | 0.472" (12.00mm) | 4.64°C/W @ 200 LFM | Black Anodized | |||
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1,055
Ships today + free overnight shipping
|
Advanced Thermal Solutions Inc. | HEAT SINK 32MM X 50MM X 12MM | maxiGRIP | Active | Aluminum | Top Mount | Rectangular, Angled Fins | 1.260" (32.00mm) | 1.969" (50.00mm) | - | Flip Chip Processors | Clip | 0.472" (12.00mm) | 3.20°C/W @ 200 LFM | Black Anodized | |||
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3,972
Ships today + free overnight shipping
|
Advanced Thermal Solutions Inc. | HEAT SINK 32MM X 50MM X 12MM | maxiGRIP | Active | Aluminum | Top Mount | Rectangular, Angled Fins | 1.260" (32.00mm) | 1.969" (50.00mm) | - | Flip Chip Processors | Clip | 0.472" (12.00mm) | 3.80°C/W @ 200 LFM | Black Anodized |
