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- Material :
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- Height Off Base (Height of Fin) :
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- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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7 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,148
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | TO-218 | Bolt On and PC Pin | 1.000" (25.40mm) | 12.0W @ 50°C | 1.00°C/W @ 800 LFM | 4.50°C/W | Black Anodized | |||
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3,454
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CUI Inc. | HEAT SINK, EXTRUSION, TO-218, 50 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.654" (42.00mm) | TO-218 | PC Pin | 0.984" (25.00mm) | 12.8W @ 75°C | 2.45°C/W @ 200 LFM | 5.86°C/W | Black Anodized | |||
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1,433
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CUI Inc. | HEAT SINK, EXTRUSION, TO-218, 50 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.638" (41.60mm) | TO-218 | PC Pin | 0.984" (25.00mm) | 13.0W @ 75°C | 3.44°C/W @ 200 LFM | 5.77°C/W | Black Anodized | |||
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2,739
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CUI Inc. | HEAT SINK, EXTRUSION,TO-218, 50. | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.638" (41.60mm) | TO-218 | PC Pin | 0.984" (25.00mm) | 12.8W @ 75°C | 2.98°C/W @ 200 LFM | 5.86°C/W | Black Anodized | |||
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3,214
Ships today + free overnight shipping
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CUI Inc. | HEAT SINK, EXTRUSION, TO-218, 50 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.638" (41.60mm) | TO-218 | PC Pin | 0.984" (25.00mm) | 12.8W @ 75°C | 2.98°C/W @ 200 LFM | 5.86°C/W | Black Anodized | |||
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2,646
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | TO-218 | Bolt On | 1.000" (25.40mm) | 6.0W @ 30°C | 1.00°C/W @ 800 LFM | 4.50°C/W | Black Anodized | |||
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3,603
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218 SOLDER PIN | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | TO-218 | Bolt On and PC Pin | 1.000" (25.40mm) | 12.0W @ 50°C | 1.00°C/W @ 800 LFM | 4.50°C/W | Black Anodized |
