- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
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2 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,128
Ships today + free overnight shipping
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CUI Inc. | HEAT SINK, EXTRUSION, TO-220, 50 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.969" (50.00mm) | 1.378" (35.00mm) | - | TO-220 | PC Pin | 1.000" (25.40mm) | 12.2W @ 75°C | 2.88°C/W @ 200 LFM | 6.15°C/W | Black Anodized | |||
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1,320
Ships today + free overnight shipping
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CUI Inc. | HEAT SINK, EXTRUSION, TO-220, 50 | HSE | Active | Aluminum Alloy | Board Level, Vertical | Rectangular, Fins | 1.969" (50.00mm) | 1.378" (35.00mm) | - | TO-220 | PC Pin | 0.492" (12.50mm) | 8.9W @ 75°C | 4.85°C/W @ 200 LFM | 8.43°C/W | Black Anodized |
