- Part Status :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
- Material Finish :
- Applied Filters :
22 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2,410
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Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Black Paint | |||
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1,746
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Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | Tin | |||
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2,521
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Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | - | Tin | |||
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1,001
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Advanced Thermal Solutions Inc. | HEATSINK TO-220 COPPER W/TAB | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and Board Mounts | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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863
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Advanced Thermal Solutions Inc. | HEATSINK TO-220 COPPER W/TAB | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and Board Mounts | 0.500" (12.70mm) | - | 7.00°C/W @ 200 LFM | 13.00°C/W | Tin | |||
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3,466
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | 13.00°C/W | Tin | |||
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2,949
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t-Global Technology | PH3 76.2X25.4X0.21MM | PH3 | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | |||
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3,741
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t-Global Technology | PH3N NANO 101.6X25.4X0.07MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 4.000" (101.60mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.003" (0.07mm) | - | - | - | Polyester | |||
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3,508
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t-Global Technology | PH3N NANO 101.6X25.4X0.062MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 4.000" (101.60mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.002" (0.06mm) | - | - | - | Polyester | |||
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2,758
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t-Global Technology | PH3N NANO 76.2X25.4X0.07MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.003" (0.07mm) | - | - | - | Polyester | |||
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3,433
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t-Global Technology | PH3N NANO 76.2X25.4X0.062MM | PH3n | Active | Copper | Heat Spreader | Rectangular | 3.000" (76.20mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.002" (0.06mm) | - | - | - | Polyester | |||
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3,896
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
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1,848
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
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1,735
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
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2,453
Ships today + free overnight shipping
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t-Global Technology | PH3 101.6X25.4X0.21MM | PH3 | Active | Copper | Heat Spreader | Rectangular | 4.000" (101.60mm) | 1.000" (25.40mm) | Assorted (BGA, LGA, CPU, ASIC...) | Adhesive | 0.008" (0.21mm) | - | - | - | Polyester | |||
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3,242
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Assmann WSW Components | HEATSINK TO-263 19.38X25.40MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | - | - | 23.00°C/W | Tin | |||
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2,075
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 12.50°C/W | Tin | |||
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872
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .45" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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3,327
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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2,594
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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3,374
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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1,580
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK COPPER TO-220 W/TABS | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 6.00°C/W @ 300 LFM | 12.50°C/W | Tin |
