- Package Cooled :
- Attachment Method :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Natural :
4 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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1,402
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | TO-220 | Clip and PC Pin | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.70°C/W | Black Anodized | |||
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1,654
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | TO-218 | Bolt On and PC Pin | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Black Anodized | |||
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2,794
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218 SOLDER PIN | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | TO-218 | Bolt On and PC Pin | 12.0W @ 70°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Black Anodized | |||
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3,504
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK 1" TO-220 | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.000" (25.40mm) | 1.650" (41.91mm) | TO-220 | Bolt On and PC Pin | 4.0W @ 30°C | 4.00°C/W @ 200 LFM | 5.50°C/W | Black Anodized |