- Material :
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- Thermal Resistance @ Forced Air Flow :
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2 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,673
Ships today + free overnight shipping
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Comair Rotron | HEATSINK EXTRUDED 16X16.5X50.8MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 2.000" (50.80mm) | 0.650" (16.51mm) | TO-220, TO-218 | Bolt On and PC Pin | 0.630" (16.00mm) | 1.5W @ 20°C | 2.00°C/W @ 800 LFM | Black Anodized | |||
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1,746
Ships today + free overnight shipping
|
Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | Tin |
