- Material :
- Length :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Material Finish :
3 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
2,916
Ships today + free overnight shipping
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | |||
|
|
766
Ships today + free overnight shipping
|
Comair Rotron | HEATSINK STAMP 25.4X12.7X30MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 0.997" (25.33mm) | TO-220 | Clip and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 5.00°C/W @ 400 LFM | Black Anodized | |||
|
|
|
2,446
Ships today + free overnight shipping
|
Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | Tin |
