- Series :
- Part Status :
- Material :
- Package Cooled :
- Attachment Method :
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10 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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1,122
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Ohmite | HEATSINK FOR TO-268 | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | |||
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2,998
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Ohmite | TO-268 HEAT SINK /POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | |||
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1,264
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Ohmite | TO-268 HEAT SINK /POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | |||
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1,438
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Ohmite | HEATSINK FOR TO-268 BLACK | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | |||
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1,404
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Advanced Thermal Solutions Inc. | HEATSINK TO-218/TO-220 BLACK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.772" (45.00mm) | 1.220" (30.99mm) | - | TO-220, TO-218 | Bolt On and PC Pin | 0.500" (12.70mm) | - | 9.00°C/W @ 200 LFM | 13.00°C/W | Black Anodized | |||
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1,222
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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3,147
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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1,326
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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3,447
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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1,826
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Apex Microtechnology | HEATSINK SMT | Apex Precision Power® | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD | SMD Pad | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable |
