- Part Status :
- Type :
- Package Cooled :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
- Thermal Resistance @ Natural :
9 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
1,746
Ships today + free overnight shipping
|
Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | Tin | |||
|
|
3,896
Ships today + free overnight shipping
|
CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
|
|
|
1,848
Ships today + free overnight shipping
|
CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
|
|
|
1,735
Ships today + free overnight shipping
|
CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
|
|
3,242
Ships today + free overnight shipping
|
Assmann WSW Components | HEATSINK TO-263 19.38X25.40MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | - | - | 23.00°C/W | Tin | |||
|
|
872
Ships today + free overnight shipping
|
Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .45" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
|
|
3,327
Ships today + free overnight shipping
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
|
|
|
2,594
Ships today + free overnight shipping
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
|
|
|
3,374
Ships today + free overnight shipping
|
Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin |
