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| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin |
