- Part Status :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
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9 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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2,446
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Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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1,746
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Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | Tin | |||
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2,080
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level | Rectangular, Fins | 1.040" (26.42mm) | 0.866" (22.00mm) | TO-220 | Clip | 0.375" (9.52mm) | 3.5W @ 70°C | 7.00°C/W @ 500 LFM | 19.20°C/W | Tin | |||
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2,995
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | |||
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3,896
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
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1,848
Ships today + free overnight shipping
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
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1,735
Ships today + free overnight shipping
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CUI Inc. | HEAT SINK, STAMPING, TO-263, 19. | - | Active | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-220 | - | 0.450" (11.43mm) | 3.8W @ 75°C | 5.50°C/W @ 200 LFM | 21.90°C/W | Tin | |||
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2,099
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TIN CLIP-ON 21MM | - | Active | Copper | Board Level | Rectangular, Fins | 0.780" (19.81mm) | 0.520" (13.21mm) | TO-220 | Clip and Board Locks | 0.515" (13.08mm) | 1.0W @ 30°C | 8.00°C/W @ 400 LFM | 20.30°C/W | Tin | |||
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3,692
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 TIN CLIP-ON 13MM | - | Active | Copper | Board Level | Rectangular, Fins | 0.780" (19.81mm) | 0.520" (13.21mm) | TO-220 | Clip and PC Pin | 0.515" (13.08mm) | 1.5W @ 50°C | 8.00°C/W @ 500 LFM | 28.30°C/W | Tin |