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35 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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2,432
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Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin | |||
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3,874
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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2,446
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Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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1,746
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Comair Rotron | HEATSINK STAMP 19.4X25.4X11.4MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 1.5W @ 20°C | 4.00°C/W @ 200 LFM | - | Tin | |||
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900
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Wakefield-Vette | HEATSINK DPAK SMT TIN PLATED | 217 | Obsolete | Copper | Top Mount | Rectangular | 0.740" (18.80mm) | 0.600" (15.24mm) | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | SMD Pad | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | |||
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2,298
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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3,242
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Assmann WSW Components | HEATSINK TO-263 19.38X25.40MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | - | - | 23.00°C/W | Tin | |||
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1,222
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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3,147
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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1,326
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D-PAK3 TIN PLATED SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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3,770
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Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | |||
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3,252
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Assmann WSW Components | HEATSINK TO-263 12.70X26.20MM | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | |||
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1,742
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Wakefield-Vette | HEATSINK DPAK SMT TIN PLATED | 217 | Active | Copper | Top Mount | Rectangular, Fins | 0.740" (18.80mm) | 0.600" (15.24mm) | D²Pak (TO-263), SOL-20, SOT-223, TO-220 | SMD Pad | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin | |||
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3,886
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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872
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .45" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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3,327
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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2,594
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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3,374
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | TO-263 (D²Pak) | SMD Pad | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | |||
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979
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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3,136
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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2,431
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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701
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | |||
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3,491
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,852
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,966
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,557
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Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | |||
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1,153
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Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | |||
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3,128
Ships today + free overnight shipping
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Assmann WSW Components | HEAT SINK ALUM DPAK TO-252 | - | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | D²Pak, TO-252 | SMD Pad | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | |||
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3,447
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | - | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | D³Pak | SMD Pad | 0.401" (10.20mm) | 1.0W @ 20°C | 4.00°C/W @ 600 LFM | 14.00°C/W | Tin | |||
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3,439
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Wakefield-Vette | HEATSINK ALUM NATURAL SMD | 218 | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD | SMD Pad | 0.400" (10.16mm) | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin |