- Part Status :
- Material :
- Length :
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- Attachment Method :
- Height Off Base (Height of Fin) :
- Thermal Resistance @ Forced Air Flow :
4 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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2,446
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Comair Rotron | HEATSINK STAMP 25.9X15X9.5MM | - | Obsolete | Copper | Board Level | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak) | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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3,492
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Clip and PC Pin | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Tin | |||
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2,298
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | |||
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3,886
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.590" (15.00mm) | 1.020" (25.91mm) | TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10 | SMD Pad | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin |
