- Part Status :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Natural :
9 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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2,432
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Comair Rotron | HEATSINK STAMP 26.2X12.7X9.9MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | SMD Pad | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | - | Tin | |||
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2,995
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | |||
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3,937
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 0.848" (21.55mm) | 0.900" (22.86mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | |||
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3,152
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375"TO-220 | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.100" (27.94mm) | 0.866" (22.00mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 40°C | 10.00°C/W @ 200 LFM | 19.20°C/W | Tin | |||
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3,602
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .515"TO-220 | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 0.780" (19.81mm) | 0.520" (13.21mm) | TO-220 | Clip and PC Pin | 0.515" (13.08mm) | 1.0W @ 30°C | 10.00°C/W @ 200 LFM | 20.30°C/W | Tin | |||
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2,448
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375"TO-220 | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 0.750" (19.05mm) | 0.750" (19.05mm) | TO-220 | Bolt On and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 25.80°C/W | Tin | |||
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3,491
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,852
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,966
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin |
