- Material :
- Package Cooled :
- Attachment Method :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
11 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,492
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Clip and PC Pin | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | 18.00°C/W | Tin | |||
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1,001
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Advanced Thermal Solutions Inc. | HEATSINK TO-220 COPPER W/TAB | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.180" (29.97mm) | 1.000" (25.40mm) | TO-220 | Bolt On and Board Mounts | 0.500" (12.70mm) | - | 13.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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1,586
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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1,825
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,384
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,371
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Assmann WSW Components | HEATSINK ALUM ANOD | - | Active | Aluminum | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | Clip and Board Mounts | 0.335" (8.50mm) | - | - | 18.00°C/W | Tin | |||
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1,856
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Advanced Thermal Solutions Inc. | HEATSINK TO-263 COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D²Pak) | - | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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701
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | |||
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3,491
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,852
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,966
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin |
