- Part Status :
- Package Cooled :
- Height Off Base (Height of Fin) :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Natural :
12 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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3,815
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Wakefield-Vette | HEATSINK CPU 27.9MM SQ W/ADH BLK | 658 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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2,606
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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976
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Obsolete | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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2,125
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 14W H=0.82" BLK | - | Active | Aluminum | Board Level | Square, Pin Fins | 2.500" (63.50mm) | 2.500" (63.50mm) | TO-3 | Bolt On | 0.821" (20.86mm) | 6.0W @ 40°C | 2.00°C/W @ 500 LFM | 4.90°C/W | Black Anodized | |||
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1,853
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-3 1.00" BLK | - | Active | Aluminum | Board Level | Rhombus | 1.880" (47.75mm) | 1.400" (35.56mm) | TO-3 | Bolt On | 1.000" (25.40mm) | 5.0W @ 40°C | 2.00°C/W @ 500 LFM | 8.40°C/W | Black Anodized | |||
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1,146
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 10W H=1.5" BLK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | TO-220 | Bolt On | 1.000" (25.40mm) | 8.0W @ 40°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,430
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/OTAPE | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Not Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,006
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 27.9MM SQ W/ADH BLK | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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2,703
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 SOLDERPIN/CLIP | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | TO-220 | Clip and PC Pin | 1.000" (25.40mm) | 8.0W @ 40°C | 2.00°C/W @ 500 LFM | 5.00°C/W | Black Anodized | |||
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1,796
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Included) | 0.600" (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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3,729
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 28MM SQ BLK W/TAPE | 658 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | Thermal Tape, Adhesive (Included) | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,762
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-218 W/PINS 1.5"TALL | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.500" (38.10mm) | 1.650" (41.91mm) | TO-218 | Bolt On and PC Pin | 1.000" (25.40mm) | 10.0W @ 50°C | 2.00°C/W @ 500 LFM | 5.00°C/W | Black Anodized |