- Part Status :
- Packaging :
- Operating Temperature :
- Package / Case :
- Supplier Device Package :
- Peripherals :
- Core Processor :
- Speed :
- Oscillator Type :
16 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Data Converters | Oscillator Type | |
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3,464
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC51xx | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | ||||
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1,813
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | ||||
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2,586
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Obsolete | Tray | 0°C ~ 70°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | ||||
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2,675
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | MCF5301x | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 61 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG | - | ROMless | - | Internal | ||||
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3,583
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | MCF5301x | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 61 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG | - | ROMless | - | Internal | ||||
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1,467
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 208LQFP | MCF5301x | Obsolete | Tray | -40°C ~ 85°C (TA) | 208-LQFP | 208-TQFP (28x28) | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 61 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB OTG | - | ROMless | - | Internal | ||||
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3,547
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NXP USA Inc. | TELEMATICS PROCESSOR W/O MBX GRA | MPC5123 | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | ||||
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1,607
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5123 | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | ||||
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1,578
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516TEPBGA | MPC5121e | Active | Tray | -40°C ~ 85°C (TA) | 516-BBGA Exposed Pad | 516-TEPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External | ||||
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1,262
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF5301x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 83 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | Internal | ||||
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619
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NXP USA Inc. | AMADEUS+USB | MCF525x | Active | Tape & Reel (TR) | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
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1,119
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Active | Tray | -20°C ~ 70°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
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2,619
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF5301x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 83 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | Internal | ||||
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2,494
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF5301x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, PWM, WDT | Coldfire V3 | 240MHz | 1.08 V ~ 3.6 V | 83 | 128K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, Memory Card, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | - | Internal | ||||
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3,435
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 225MAPBGA | MCF525x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 225-LFBGA | 225-MAPBGA (13x13) | DMA | Coldfire V2 | 140MHz | 1.08 V ~ 3.6 V | - | 128K x 8 | 32-Bit | ATA, Audio, CAN, EBI/EMI, I²C, IDE, SD, SPI, UART/USART, USB OTG | - | ROMless | A/D 6x12b | External | ||||
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1,521
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 516FPBGA | MPC5121e | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, WDT | e300 | 400MHz | 1.08 V ~ 3.6 V | 147 | 128K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, USB OTG | - | ROMless | - | External |