- Manufacture :
- Part Status :
- Packaging :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Program Memory Size :
- EEPROM Size :
- Data Converters :
41 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,535
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 516FBGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 516-BBGA | 516-FPBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,536
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NXP USA Inc. | IC MCU 32BIT 6MB FLASH 416BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,642
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 416-BBGA | 416-PBGA (27x27) | DMA, POR, PWM | e200z7 | 180MHz | 1.14 V ~ 1.32 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, SCI, SPI | 6MB (6M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,205
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NXP USA Inc. | IC MCU 32BIT 1.5MB FLASH 473BGA | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 473-LFBGA | 473-MAPBGA (19x19) | DMA, POR, PWM, WDT | e200z7d | 180MHz | 1.14 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, EBI/EMI, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 34x12b | Internal | |||
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908
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE POWER | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 257-LFBGA | 257-MAPBGA (14x14) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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3,210
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,287
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 200MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,303
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NXP USA Inc. | IC MCU 32BIT 2.5MB FLASH 144LQFP | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | 79 | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,182
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NXP USA Inc. | 32-BIT MCU DUAL CORE POWER ARCH | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,655
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 180 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 180MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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2,215
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NXP USA Inc. | 2.5MB NVM 2 X E200Z4 CORES 150 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 144-LQFP | 144-LQFP (20x20) | DMA, LVD, POR, WDT | e200z4 | 150MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, LIN, SPI, UART/USART | 2.5MB (2.5M x 8) | Flash | - | A/D 64x12b | Internal | |||
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1,582
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NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,365
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,163
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,784
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,551
Ships today + free overnight shipping
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,606
Ships today + free overnight shipping
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | - | -40°C ~ 125°C (TA) | - | - | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,470
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,023
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tray | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 50 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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3,102
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tray | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 53 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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3,625
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tray | -40°C ~ 125°C (TA) | 64-WFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 53 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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3,524
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tray | -40°C ~ 125°C (TA) | 64-WFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 56 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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2,808
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 50 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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1,823
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-TQFP | 64-TQFP (10x10) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 53 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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2,458
Ships today + free overnight shipping
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-WFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 53 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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2,855
Ships today + free overnight shipping
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Silicon Labs | EFM32 GIANT GECKO 11 ULTRA LOW P | Giant Gecko S1 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 64-WFQFN Exposed Pad | 64-QFN (9x9) | Brown-out Detect/Reset, DMA, POR, PWM, WDT | ARM® Cortex®-M4 | 72MHz | 1.8 V ~ 3.6 V | 56 | 384K x 8 | 32-Bit | CAN, EBI/EMI, I²C, IrDA, LIN, SmartCard, SPI, UART/USART | 2MB (2M x 8) | Flash | - | - | Internal | |||
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3,549
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NXP USA Inc. | NXP 32-BIT MCU DUAL CORE 3MB FLA | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 256-LBGA | 256-MAPPBGA (17x17) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,698
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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2,568
Ships today + free overnight shipping
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,703
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NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 100-LBGA | 100-MAPBGA (11x11) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal |
