- Manufacture :
- Part Status :
- Packaging :
- Operating Temperature :
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- Voltage - Supply (Vcc/Vdd) :
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82 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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664
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NXP USA Inc. | IC MCU 32BIT ROMLESS 176LQFP | MCF5227x | Obsolete | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, LCD, PWM, WDT | Coldfire V2 | 120MHz | 1.4 V ~ 1.6 V | 47 | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SPI, SSI, UART/USART, USB OTG | - | ROMless | - | - | External | |||
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1,413
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NXP USA Inc. | IC MCU 32BIT ROMLESS 176LQFP | MCF5227x | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, LCD, PWM, WDT | Coldfire V2 | 120MHz | 1.4 V ~ 1.6 V | 47 | 128K x 8 | 32-Bit | CAN, EBI/EMI, I²C, SPI, SSI, UART/USART, USB OTG | - | ROMless | - | - | External | |||
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2,547
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,439
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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660
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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2,313
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,088
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,731
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,872
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,757
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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3,464
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH CORE | MPC56xx Qorivva | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 5.25 V | 84 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 40x12b | Internal | |||
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1,365
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,561
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,732
Ships today + free overnight shipping
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,516
Ships today + free overnight shipping
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NXP USA Inc. | NXP 32-BIT MCU POWER ARCH 1.5M | MPC56xx Qorivva | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, I²C, LIN, SCI, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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1,163
Ships today + free overnight shipping
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,784
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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3,975
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,470
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,434
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STMicroelectronics | IC MCU 32BIT 4MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 118 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 34x12b | Internal | |||
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630
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STMicroelectronics | IC MCU 32BIT 4MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 118 | 192K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 4MB (4M x 8) | Flash | - | A/D 34x12b | Internal | |||
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3,104
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Microchip Technology | IC MCU 32BIT 1MB FLASH 176LQFP | SAM4CP | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | ARM® Cortex®-M4/M4F | 120MHz | 1.08 V ~ 3.6 V | 69 | 152K x 8 | 32-Bit Dual-Core | I²C, IrDA, SPI, UART/USART | 1MB (1M x 8) | Flash | - | A/D 8x10b | Internal | |||
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700
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STMicroelectronics | IC MCU 32BIT 1.5MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4d | 120MHz | 3 V ~ 5.5 V | 147 | 128K x 8 | 32-Bit | CAN, LIN, SPI, UART/USART | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 27x10b, 5x12b | Internal | |||
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746
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STMicroelectronics | IC MCU 32BIT 2MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 150 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 34x12b | Internal | |||
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1,226
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STMicroelectronics | IC MCU 32BIT 2MB FLASH 176LQFP | Automotive, AEC-Q100, SPC56 | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 150 | 128K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 2MB (2M x 8) | Flash | - | A/D 34x12b | Internal | |||
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2,905
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STMicroelectronics | IC MCU 32BIT 1MB FLASH 176LQFP | STM32F2 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP | 176-LQFP (24x24) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M3 | 120MHz | 1.8 V ~ 3.6 V | 140 | 132K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, Memory Card, SPI, UART/USART, USB OTG | 1MB (1M x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | |||
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1,257
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STMicroelectronics | IC MCU 32BIT 768KB FLASH 176LQFP | STM32F2 | Active | Tray | -40°C ~ 85°C (TA) | 176-LQFP | 176-LQFP (24x24) | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT | ARM® Cortex®-M3 | 120MHz | 1.8 V ~ 3.6 V | 140 | 132K x 8 | 32-Bit | CAN, Ethernet, I²C, IrDA, LIN, Memory Card, SPI, UART/USART, USB OTG | 768KB (768K x 8) | Flash | - | A/D 24x12b, D/A 2x12b | Internal | |||
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3,897
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STMicroelectronics | IC MCU 32BIT 3MB FLASH 176LQFP | SPC56 | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP | 176-LQFP (24x24) | DMA, POR, PWM, WDT | e200z4 | 120MHz | 1.14 V ~ 1.32 V | 118 | 160K x 8 | 32-Bit | CAN, EBI/EMI, LIN, SCI, SPI | 3MB (3M x 8) | Flash | - | A/D 34x12b | Internal | |||
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2,943
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | |||
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1,698
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal |
