- Package / Case :
- Supplier Device Package :
4 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | Oscillator Type | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,438
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 196MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 196-LBGA | 196-MAPBGA (15x15) | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | |||
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2,101
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | |||
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1,034
Ships today + free overnight shipping
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NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | CAN, EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External | |||
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1,634
Ships today + free overnight shipping
|
NXP USA Inc. | IC MCU 32BIT ROMLESS 256MAPBGA | MCF532x | Not For New Designs | Tray | -40°C ~ 85°C (TA) | 256-LBGA | 256-MAPBGA | DMA, LCD, PWM, WDT | Coldfire V3 | 240MHz | 1.4 V ~ 3.6 V | 94 | 32K x 8 | 32-Bit | EBI/EMI, Ethernet, I²C, SPI, SSI, UART/USART, USB, USB OTG | - | ROMless | External |
