- Series :
- Part Status :
- Packaging :
- Operating Temperature :
- Supplier Device Package :
- Peripherals :
- Core Processor :
- Voltage - Supply (Vcc/Vdd) :
- Core Size :
- Data Converters :
- Oscillator Type :
21 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Peripherals | Core Processor | Speed | Voltage - Supply (Vcc/Vdd) | Number of I/O | RAM Size | Core Size | Connectivity | Program Memory Size | Program Memory Type | EEPROM Size | Data Converters | Oscillator Type | |
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1,582
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NXP USA Inc. | SINGLE CORE, 3M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,365
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,855
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NXP USA Inc. | DUAL CORE 2M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,163
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,784
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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646
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NXP USA Inc. | DUAL CORE 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z2, e200z4 | 80MHz, 160MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit Dual-Core | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,592
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NXP USA Inc. | SINGLE CORE, 1.5M FLASH | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 160MHz | 3.15 V ~ 5.5 V | - | 192K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 1.5MB (1.5M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,975
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,470
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,864
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Cypress Semiconductor Corp | IC MCU 32BIT 2MB FLASH 176LQFP | FR MB91520 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-TEQFP (24x24) | DMA, LVD, POR, PWM, WDT | FR81S | 80MHz | 2.7 V ~ 5.5 V | 147 | 336K x 8 | 32-Bit | CAN, CSIO, EBI/EMI, I²C, LIN, SPI, UART/USART | 2.0625MB (2.0625M x 8) | Flash | 64K x 8 | A/D 48x12b, D/A 2x8b | External | ||||
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2,943
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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1,698
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,568
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NXP USA Inc. | SINGLE CORE 3M FLASH 384K RAM | MPC57xx | Active | Tray | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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3,886
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 384 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,037
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NXP USA Inc. | 32 BIT SINGLE CORE 3M FLASH 3 | MPC57xx | Active | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 384K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 3MB (3M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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875
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NXP USA Inc. | SINGLE CORE 2M FLASH 256K RAM | MPC57xx | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-LQFP (24x24) | DMA, I²S, POR, WDT | e200z4 | 120MHz | 3.15 V ~ 5.5 V | - | 256K x 8 | 32-Bit | CAN, Ethernet, FlexRay, I²C, LIN, SPI | 2MB (2M x 8) | Flash | 64K x 8 | A/D 36x10b, 16x12b | Internal | ||||
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2,619
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Cypress Semiconductor Corp | IC MCU 32BIT 1.5MB FLASH 176LQFP | FR MB91520 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-TEQFP (24x24) | DMA, LVD, POR, PWM, WDT | FR81S | 80MHz | 2.7 V ~ 5.5 V | 147 | 208K x 8 | 32-Bit | CAN, CSIO, EBI/EMI, I²C, LIN, SPI, UART/USART | 1.5625MB (1.5625M x 8) | Flash | 64K x 8 | A/D 48x12b, D/A 2x8b | External | ||||
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1,519
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Cypress Semiconductor Corp | IC MCU 32BIT 2MB FLASH 176LQFP | FR MB91520 | Active | Tray | -40°C ~ 105°C (TA) | 176-LQFP Exposed Pad | 176-TEQFP (24x24) | DMA, LVD, POR, PWM, WDT | FR81S | 80MHz | 2.7 V ~ 5.5 V | 147 | 336K x 8 | 32-Bit | CAN, CSIO, EBI/EMI, I²C, LIN, SPI, UART/USART | 2.0625MB (2.0625M x 8) | Flash | 64K x 8 | A/D 48x12b, D/A 2x8b | External | ||||
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2,186
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | AURIX™ | Not For New Designs | Digi-Reel® | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | PG-LQFP-176-22 | DMA, WDT | TriCore™ | 200MHz | 3 V ~ 5.5 V | 112 | 472K x 8 | 32-Bit Dual-Core | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 4MB (4M x 8) | Flash | 64K x 8 | A/D 40x12b, 6 x Sigma-Delta | External | ||||
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944
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | AURIX™ | Not For New Designs | Cut Tape (CT) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | PG-LQFP-176-22 | DMA, WDT | TriCore™ | 200MHz | 3 V ~ 5.5 V | 112 | 472K x 8 | 32-Bit Dual-Core | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 4MB (4M x 8) | Flash | 64K x 8 | A/D 40x12b, 6 x Sigma-Delta | External | ||||
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2,359
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Infineon Technologies | IC MCU 32BIT 4MB FLASH 176LQFP | AURIX™ | Not For New Designs | Tape & Reel (TR) | -40°C ~ 125°C (TA) | 176-LQFP Exposed Pad | PG-LQFP-176-22 | DMA, WDT | TriCore™ | 200MHz | 3 V ~ 5.5 V | 112 | 472K x 8 | 32-Bit Dual-Core | ASC, CAN, Ethernet, FlexRay, HSSL, I²C, LIN, MSC, PSI5, QSPI, SENT | 4MB (4M x 8) | Flash | 64K x 8 | A/D 40x12b, 6 x Sigma-Delta | External |