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Maxim Integrated | IC TDM OVER PACKET 676-BGA | - | Active | Tray | -40°C ~ 85°C | Surface Mount | 676-BGA | TDMoP | 676-TEPBGA (27x27) | 1 | 1.8V, 3.3V | TDM-over-Packet (TDMoP) |
