OKAYCHIP
BOM
5 products
IMAGE PART NO. PRICE QUANTITY STOCK MANUFACTURE DESCRIPTION Series Part Status Color Packaging Size / Dimension Type Height Configuration Current - Max Current - Test Voltage - Forward (Vf) (Typ) Wavelength Viewing Angle CCT (K) Flux @ Current/Temperature - Test Temperature - Test Lumens/Watt @ Current - Test Light Emitting Surface (LES) Lens Type
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Per Unit
$2.3823
RFQ
1,110
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Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 19.00mm L x 19.00mm W Chip On Board (COB) 1.50mm Square 1.15A 450mA 34.6V - 115° 3300K 1823 lm (Typ) 85°C 105 lm/W 14.50mm Diameter Flat
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Per Unit
$1.7263
RFQ
3,526
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Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 13.50mm L x 13.50mm W Chip On Board (COB) 1.50mm Square 920mA 360mA 34.6V - 115° 3300K 1394 lm (Typ) 85°C 112 lm/W 9.80mm Diameter Flat
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Per Unit
$3.4207
RFQ
2,665
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Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 19.00mm L x 19.00mm W Chip On Board (COB) 1.50mm Square 1.84A 720mA 34.6V - 115° 3300K 2827 lm (Typ) 85°C 113 lm/W 14.50mm Diameter Flat
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Per Unit
$2.7964
RFQ
3,971
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Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 19.00mm L x 19.00mm W Chip On Board (COB) 1.50mm Square 1.38A 540mA 34.6V - 115° 3300K 2160 lm (Typ) 85°C 116 lm/W 14.50mm Diameter Flat
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Per Unit
$4.0792
RFQ
3,442
Ships today + free overnight shipping
Samsung Semiconductor, Inc. HIGH POWER LED SERIES CHIP ON BO COB D Gen2 Active White, Warm Tray 19.00mm L x 19.00mm W Chip On Board (COB) 1.50mm Square 2.3A 900mA 34.6V - 115° 3300K 3488 lm (Typ) 85°C 112 lm/W 14.50mm Diameter Flat
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