- Series :
- Height :
- Attachment Method :
22 products
IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Operating Temperature | Type | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1,980
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Laird Technologies EMI | AP COIL BF USFT PSA | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
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3,798
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Laird Technologies EMI | GASKET BECU 7.11X609.6MM | No Snag | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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3,810
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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2,621
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Laird Technologies EMI | AP,STR,SU,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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3,857
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Laird Technologies EMI | AP,STR,SNB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.055" (1.40mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
|
3,324
Ships today + free overnight shipping
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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2,928
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Laird Technologies EMI | AP,STR,NIB,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,451
Ships today + free overnight shipping
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Laird Technologies EMI | AP,STR,NIE,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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3,297
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Laird Technologies EMI | AP,STR,ZNY,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Yellow Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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1,055
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Laird Technologies EMI | AP,STR,ZNC,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Zinc + Clear Chromate | 299.21µin (7.60µm) | Adhesive | ||||
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3,991
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Laird Technologies EMI | AP,STR,NID,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
|
715
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Nickel | 299.21µin (7.60µm) | Adhesive | ||||
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2,850
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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3,805
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Laird Technologies EMI | RFI EMI GROUNDING MATERIAL 25FT | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | ||||
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1,597
Ships today + free overnight shipping
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Laird Technologies EMI | AP,STR,BF,USF,PSA | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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2,217
Ships today + free overnight shipping
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Laird Technologies EMI | AP,STR,BF | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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2,679
Ships today + free overnight shipping
|
Laird Technologies EMI | AP COIL BF | All-Purpose | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | - | - | Adhesive | ||||
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1,566
Ships today + free overnight shipping
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Laird Technologies EMI | GASKET BECU 7.11X406.4MM | - | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Tin | 299.21µin (7.60µm) | Adhesive | ||||
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2,667
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Laird Technologies EMI | GASKET BECU 7.11X18.54MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.280" (7.11mm) | - | - | Slot | ||||
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2,448
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Laird Technologies EMI | GASKET BECU 7.11X13.82MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.543" (13.79mm) | 0.280" (7.11mm) | - | - | Slot | ||||
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724
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Laird Technologies EMI | GASKET BECU 7.11X9.04MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.356" (9.04mm) | 0.280" (7.11mm) | - | - | Slot | ||||
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3,591
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Laird Technologies EMI | GASKET BECU 7.11X4.32MM | Slot Mount | Active | Beryllium Copper | 121°C | Fingerstock | - | 0.110" (2.79mm) | 0.169" (4.29mm) | 0.280" (7.11mm) | - | - | Slot |