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AR18-HZL/07-TT

MANUFACTURER
Assmann WSW Components
PRODUCT CATEGORY
Sockets for ICs, Transistors
Description
CONN IC DIP SOCKET 18POS GOLD

NO PRICE

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Manufacturer :
Assmann WSW Components
Product Category :
Sockets for ICs, Transistors
Contact Finish - Mating :
Gold
Contact Finish - Post :
Tin
Contact Finish Thickness - Mating :
30.0µin (0.76µm)
Contact Finish Thickness - Post :
200.0µin (5.08µm)
Contact Material - Mating :
Beryllium Copper
Contact Material - Post :
Beryllium Copper
Features :
Open Frame
Housing Material :
Thermoplastic, Polyester
Mounting Type :
Through Hole
Number of Positions or Pins (Grid) :
18 (2 x 9)
Operating Temperature :
-40°C ~ 105°C
Packaging :
Tube
Part Status :
Obsolete
Pitch - Mating :
0.100" (2.54mm)
Pitch - Post :
0.100" (2.54mm)
Series :
-
Termination :
Solder
Type :
DIP, 0.3" (7.62mm) Row Spacing
Datasheet :
AR18-HZL/07-TT

Cross References

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Search Part Number: "AR18" Included word is 15

Part Number Manufacturer Stock Description
AR1820HSSC12SHEA0-DR1 ON Semiconductor 2,595 IMAGE SENSOR 18MP 1/2.3 CIS
AR1820HSSC00SHEA0-DP1 ON Semiconductor 676 IMAGE SENSOR 18MP 1/2.3 CIS
AR1820HSSC12SHEA0-DP ON Semiconductor 1,038 IMAGE SENSOR 18MP 1/2.3 CIS
AR1820HSSC00SHEA0-DR ON Semiconductor 3,769 IMAGE SENSOR 18MP 1/2.3 CIS
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AR18-S02 Broadcom Limited 637 SS CW ROP5.16MM SCREW HUB 3MM
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AR18-A21E Broadcom Limited 3,331 ROP18 ABS REF ASIC 21BITS 485
AR1820HSSC31SMEAH3-GEVB ON Semiconductor 1,320 BOARD EVAL 18 MP 1/2" CIS HB
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AR1820HSSC00SHQAH-GEVB ON Semiconductor 3,222 BOARD EVAL 18 MP 1/2.3" CIS HB
AR1820HSSC00SHQAH3-GEVB ON Semiconductor 624 BOARD EVAL 18 MP 1/2.3" CIS HB
AR18-HZL-TT Assmann WSW Components 3,872 CONN IC DIP SOCKET 18POS TIN
AR18-HZW/T Assmann WSW Components 1,711 CONN IC DIP SOCKET 18POS GOLD

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