- Part Status :
- Material :
- Shape :
- Package Cooled :
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11 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,874
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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3,470
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Comair Rotron | HEATSINK STAMP 9.5X22.8X17.8MM | - | Obsolete | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | - | Black Anodized | |||
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2,995
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | |||
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3,937
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 0.848" (21.55mm) | 0.900" (22.86mm) | TO-220 | Clip and PC Pin | 0.375" (9.52mm) | 1.5W @ 50°C | 10.00°C/W @ 200 LFM | 20.80°C/W | Tin | |||
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665
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEATSINK .375"TO-220 | - | Active | Aluminum | Board Level | Rectangular, Fins | 0.700" (17.78mm) | 0.900" (22.86mm) | TO-220 | Clip | 0.375" (9.52mm) | 2.0W @ 50°C | 14.00°C/W @ 200 LFM | 25.00°C/W | Black Anodized | |||
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3,506
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CUI Inc. | HEATSINK TO-220 2.6W ALUMINUM | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.375" (9.53mm) | 0.900" (22.86mm) | TO-220 | Clip | 0.740" (18.79mm) | 2.6W @ 75°C | 6.32°C/W @ 200 LFM | 28.85°C/W | Black Anodized | |||
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979
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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3,136
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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2,431
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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2,392
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CUI Inc. | HEAT SINK, STAMPING, TO-252, 8 X | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPak) | - | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | |||
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2,578
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CTS Thermal Management Products | HEATSINK PWR .75"H BLACK TO-220 | - | Active | Aluminum | Board Level | Rhombus | 1.310" (33.27mm) | 0.900" (22.86mm) | TO-126, TO-220 | Bolt On | 0.750" (19.05mm) | - | 7.00°C/W @ 200 LFM | 50.00°C/W | Black Anodized |
