- Power Dissipation @ Temperature Rise :
- Material Finish :
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2 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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813
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.950" (24.13mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 4.0W @ 70°C | 9.00°C/W @ 200 LFM | 16.60°C/W | Tin | |||
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1,297
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-220 VERT MNT .95" | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.950" (24.13mm) | 1.000" (25.40mm) | TO-220 | Bolt On and PC Pin | 0.500" (12.70mm) | 1.0W @ 20°C | 9.00°C/W @ 200 LFM | 16.60°C/W | Black Anodized |
