- Series :
- Part Status :
- Material :
- Package Cooled :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
-
- 10.00°C/W @ 200 LFM (3)
- 10.05°C/W @ 200 LFM (1)
- 11.00°C/W @ 200 LFM (1)
- 12.50°C/W @ 600 LFM (3)
- 16.00°C/W @ 600 LFM (1)
- 17.50°C/W @ 300 LFM (1)
- 21.00°C/W @ 200 LFM (2)
- 5.00°C/W @ 600 LFM (1)
- 6.00°C/W @ 400 LFM (1)
- 6.00°C/W @ 600 LFM (4)
- 6.50°C/W @ 200 LFM (1)
- 8.00°C/W @ 300 LFM (1)
- 8.00°C/W @ 400 LFM (2)
- 8.00°C/W @ 500 LFM (4)
- Thermal Resistance @ Natural :
- Material Finish :
27 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,874
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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684
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | - | TO-220, TO-218 | Bolt On and PC Pin | 0.400" (10.16mm) | 6.0W @ 60°C | 6.00°C/W @ 400 LFM | 8.80°C/W | Black Anodized | |||
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1,122
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Ohmite | HEATSINK FOR TO-268 | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | |||
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2,998
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Ohmite | TO-268 HEAT SINK /POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | |||
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3,339
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Ohmite | TO-263 HEAT SINK / POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,264
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Ohmite | TO-268 HEAT SINK /POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | |||
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1,724
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Ohmite | TO-263 HEAT SINK / POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | |||
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631
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Advanced Thermal Solutions Inc. | HEATSINK TO-252 D-PAK COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.842" (21.40mm) | - | TO-252 (DPak) | - | 0.400" (10.16mm) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
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1,737
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Advanced Thermal Solutions Inc. | HEATSINK TRIPLE TO-126 COPPER | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.759" (44.68mm) | 1.750" (44.45mm) | - | TO-126 | Clip and Board Mounts | 0.400" (10.16mm) | - | 6.50°C/W @ 200 LFM | 15.00°C/W | Tin | |||
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2,498
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Ohmite | HEATSINK FOR TO-263 BLACK | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,317
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Ohmite | HEATSINK FOR TO-263 | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | |||
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1,438
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Ohmite | HEATSINK FOR TO-268 BLACK | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | |||
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2,509
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Apex Microtechnology | HEATSINK FOR DK AND HQ PACKAGES | Apex Precision Power® | Active | Aluminum | Board Level | Rectangular, Fins | 1.500" (38.10mm) | 0.400" (10.16mm) | - | - | Bolt On | 0.400" (10.16mm) | - | - | 16.00°C/W | - | |||
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979
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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3,136
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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2,431
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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701
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | |||
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3,491
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,852
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,966
Ships today + free overnight shipping
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,439
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Wakefield-Vette | HEATSINK ALUM NATURAL SMD | 218 | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD | SMD Pad | 0.400" (10.16mm) | 2.3W @ 40°C | 5.00°C/W @ 600 LFM | 31.00°C/W | Tin | |||
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3,549
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Wakefield-Vette | HEATSINK ALUM BLACK SMD | 218 | Active | Copper | Top Mount | Rectangular, Fins | 0.320" (8.13mm) | 0.900" (22.86mm) | - | SMD | SMD Pad | 0.400" (10.16mm) | 2.0W @ 62°C | 21.00°C/W @ 200 LFM | 31.00°C/W | Tin | |||
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2,392
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CUI Inc. | HEAT SINK, STAMPING, TO-252, 8 X | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | - | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | |||
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3,068
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Wakefield-Vette | HEATSINK TO-220 VERT BLK | 231 | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.690" (17.53mm) | 0.835" (21.21mm) | - | TO-220 | Bolt On and Board Mounts | 0.400" (10.16mm) | 2.0W @ 45°C | 8.00°C/W @ 400 LFM | - | Black Anodized | |||
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947
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Wakefield-Vette | HEATSINK | 231 | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 0.690" (17.53mm) | 0.835" (21.21mm) | - | TO-220 | Bolt On and PC Pin | 0.400" (10.16mm) | 2.0W @ 45°C | 8.00°C/W @ 400 LFM | - | Pre-Black Anodized | |||
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1,751
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Advanced Thermal Solutions Inc. | HEATSINK TO220 HOR MNT W/TAB | - | Active | Aluminum | Board Level | Rectangular, Fins | 0.742" (18.85mm) | 0.860" (21.84mm) | - | TO-220 | Bolt On | 0.400" (10.16mm) | - | 11.00°C/W @ 200 LFM | 23.20°C/W | Black Anodized | |||
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1,826
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Apex Microtechnology | HEATSINK SMT | Apex Precision Power® | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | SMD | SMD Pad | 0.400" (10.16mm) | - | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable |
