- Part Status :
- Material :
- Thermal Resistance @ Forced Air Flow :
-
- 10.00°C/W @ 200 LFM (3)
- 10.05°C/W @ 200 LFM (1)
- 11.00°C/W @ 200 LFM (1)
- 12.50°C/W @ 600 LFM (3)
- 14.00°C/W @ 200 LFM (1)
- 15.00°C/W @ 400 LFM (1)
- 16.00°C/W @ 600 LFM (1)
- 17.50°C/W @ 300 LFM (1)
- 20.00°C/W @ 100 LFM (5)
- 21.00°C/W @ 200 LFM (2)
- 25.00°C/W @ 350 LFM (5)
- 4.00°C/W @ 300 LFM (1)
- 4.50°C/W @ 200 LFM (1)
- 45.00°C/W @ 200 LFM (2)
- 5.00°C/W @ 600 LFM (1)
- 6.00°C/W @ 400 LFM (1)
- 6.00°C/W @ 600 LFM (4)
- 6.50°C/W @ 200 LFM (1)
- 8.00°C/W @ 300 LFM (1)
- 8.00°C/W @ 400 LFM (2)
- 8.00°C/W @ 500 LFM (4)
- Thermal Resistance @ Natural :
- Applied Filters :
43 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,874
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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1,393
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 1.8W @ 50°C | 14.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized | |||
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762
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Wakefield-Vette | HEATSINK 100PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | |||
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661
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Wakefield-Vette | HEATSINK 100PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | |||
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1,542
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Wakefield-Vette | HEATSINK 100PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | |||
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3,641
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Wakefield-Vette | HEATSINK 100PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - | - | |||
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684
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | - | TO-220, TO-218 | Bolt On and PC Pin | 0.400" (10.16mm) | 6.0W @ 60°C | 6.00°C/W @ 400 LFM | 8.80°C/W | Black Anodized | |||
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1,122
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Ohmite | HEATSINK FOR TO-268 | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | |||
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2,998
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Ohmite | TO-268 HEAT SINK /POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | |||
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3,339
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Ohmite | TO-263 HEAT SINK / POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,415
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Hard Anodized | |||
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1,264
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Ohmite | TO-268 HEAT SINK /POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Degreased | |||
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1,724
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Ohmite | TO-263 HEAT SINK / POLY TAPE | D | Active | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | |||
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631
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Advanced Thermal Solutions Inc. | HEATSINK TO-252 D-PAK COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.842" (21.40mm) | - | TO-252 (DPak) | - | 0.400" (10.16mm) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
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1,737
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Advanced Thermal Solutions Inc. | HEATSINK TRIPLE TO-126 COPPER | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.759" (44.68mm) | 1.750" (44.45mm) | - | TO-126 | Clip and Board Mounts | 0.400" (10.16mm) | - | 6.50°C/W @ 200 LFM | 15.00°C/W | Tin | |||
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2,498
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Ohmite | HEATSINK FOR TO-263 BLACK | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | |||
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1,317
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Ohmite | HEATSINK FOR TO-263 | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | TO-263 (D²Pak) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | |||
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3,363
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Aavid, Thermal Division of Boyd Corporation | TO-5 PUSH-ON HEATSINK | - | Active | Aluminum | Board Level | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Black Anodized | |||
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3,513
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Advanced Thermal Solutions Inc. | HEATSINK 12-SIP W/TAB BLACK | - | Active | Aluminum | Board Level, Vertical | Rectangular | 1.700" (43.18mm) | 1.250" (31.75mm) | - | 12-SIP | Bolt On and PC Pin | 0.400" (10.16mm) | - | 4.50°C/W @ 200 LFM | 10.00°C/W | Black Anodized | |||
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1,720
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Wakefield-Vette | HEATSINK 128PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | |||
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2,825
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Wakefield-Vette | HEATSINK 128PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | |||
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715
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Wakefield-Vette | HEATSINK 128PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | |||
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1,881
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Wakefield-Vette | HEATSINK 128PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | BGA | Thermal Tape, Adhesive (Included) | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | - | |||
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1,438
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Ohmite | HEATSINK FOR TO-268 BLACK | D | Discontinued at Digi-Key | Aluminum | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.220" (30.99mm) | - | TO-268 | Solderable Feet | 0.400" (10.16mm) | 5.0W @ 35°C | 6.00°C/W @ 600 LFM | - | Black Anodized | |||
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2,509
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Apex Microtechnology | HEATSINK FOR DK AND HQ PACKAGES | Apex Precision Power® | Active | Aluminum | Board Level | Rectangular, Fins | 1.500" (38.10mm) | 0.400" (10.16mm) | - | - | Bolt On | 0.400" (10.16mm) | - | - | 16.00°C/W | - | |||
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1,360
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Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.4" | 628 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.400" (10.16mm) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | - | Black Anodized | |||
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979
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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3,136
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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2,431
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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701
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin |
