- Part Status :
- Material :
- Package Cooled :
- Attachment Method :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
-
- 10.00°C/W @ 200 LFM (3)
- 10.05°C/W @ 200 LFM (1)
- 11.00°C/W @ 200 LFM (1)
- 12.50°C/W @ 600 LFM (3)
- 14.00°C/W @ 200 LFM (1)
- 15.00°C/W @ 400 LFM (1)
- 17.50°C/W @ 300 LFM (1)
- 21.00°C/W @ 200 LFM (1)
- 4.50°C/W @ 200 LFM (1)
- 45.00°C/W @ 200 LFM (2)
- 6.00°C/W @ 400 LFM (1)
- 6.50°C/W @ 200 LFM (1)
- 8.00°C/W @ 300 LFM (1)
- Thermal Resistance @ Natural :
- Material Finish :
18 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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3,874
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Comair Rotron | HEATSINK STAMP 22.9X8X10.2MM | - | Obsolete | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | - | Tin | |||
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1,393
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 1.8W @ 50°C | 14.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized | |||
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684
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level, Vertical | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | - | TO-220, TO-218 | Bolt On and PC Pin | 0.400" (10.16mm) | 6.0W @ 60°C | 6.00°C/W @ 400 LFM | 8.80°C/W | Black Anodized | |||
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1,415
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Aavid, Thermal Division of Boyd Corporation | BOARD LEVEL HEAT SINK | - | Active | Aluminum | Board Level | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Hard Anodized | |||
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631
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Advanced Thermal Solutions Inc. | HEATSINK TO-252 D-PAK COPPER | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.842" (21.40mm) | - | TO-252 (DPak) | - | 0.400" (10.16mm) | - | 21.00°C/W @ 200 LFM | 28.00°C/W | Tin | |||
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1,737
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Advanced Thermal Solutions Inc. | HEATSINK TRIPLE TO-126 COPPER | - | Active | Copper | Board Level, Vertical | Rectangular, Fins | 1.759" (44.68mm) | 1.750" (44.45mm) | - | TO-126 | Clip and Board Mounts | 0.400" (10.16mm) | - | 6.50°C/W @ 200 LFM | 15.00°C/W | Tin | |||
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3,363
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Aavid, Thermal Division of Boyd Corporation | TO-5 PUSH-ON HEATSINK | - | Active | Aluminum | Board Level | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Black Anodized | |||
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3,513
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Advanced Thermal Solutions Inc. | HEATSINK 12-SIP W/TAB BLACK | - | Active | Aluminum | Board Level, Vertical | Rectangular | 1.700" (43.18mm) | 1.250" (31.75mm) | - | 12-SIP | Bolt On and PC Pin | 0.400" (10.16mm) | - | 4.50°C/W @ 200 LFM | 10.00°C/W | Black Anodized | |||
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979
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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3,136
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Aavid, Thermal Division of Boyd Corporation | HEATSINK SMT D-PAK/TO-252 TIN | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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2,431
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D-PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | SMD Pad | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | |||
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701
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Aavid, Thermal Division of Boyd Corporation | TOP MOUNT HEATSINK .4" D2PAK | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | |||
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3,491
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,852
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Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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3,966
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|
Aavid, Thermal Division of Boyd Corporation | HEATSINK D2PAK .4" HIGH SMD | - | Active | Copper | Top Mount | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | TO-263 (D²Pak) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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2,392
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CUI Inc. | HEAT SINK, STAMPING, TO-252, 8 X | - | Active | Copper | Top Mount | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPak) | - | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | |||
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1,751
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Advanced Thermal Solutions Inc. | HEATSINK TO220 HOR MNT W/TAB | - | Active | Aluminum | Board Level | Rectangular, Fins | 0.742" (18.85mm) | 0.860" (21.84mm) | - | TO-220 | Bolt On | 0.400" (10.16mm) | - | 11.00°C/W @ 200 LFM | 23.20°C/W | Black Anodized | |||
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3,475
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Aavid, Thermal Division of Boyd Corporation | HEATSINK TO-5 .4" BLK | - | Active | Aluminum | Top Mount | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | TO-5 | Press Fit | 0.400" (10.16mm) | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | 56.00°C/W | Black Anodized |
