- Series :
- Material :
- Package Cooled :
- Power Dissipation @ Temperature Rise :
- Thermal Resistance @ Forced Air Flow :
3 products
| IMAGE | PART NO. | PRICE | QUANTITY | STOCK | MANUFACTURE | DESCRIPTION | Series | Part Status | Material | Type | Shape | Length | Width | Diameter | Package Cooled | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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1,360
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK CPU 43MM SQ BLK H=.4" | 628 | Active | Aluminum | Top Mount | Square, Pin Fins | 1.750" (44.45mm) | 1.700" (43.18mm) | - | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Not Included) | 0.400" (10.16mm) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | Black Anodized | |||
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2,814
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK 128PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.850" (21.59mm) | 0.850" (21.59mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.400" (10.16mm) | 2.5W @ 90°C | 20.00°C/W @ 100 LFM | - | |||
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3,968
Ships today + free overnight shipping
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Wakefield-Vette | HEATSINK 100PQFP COMPOSITE | Deltem™ | Active | Composite | Top Mount | Square, Pin Fins | 0.650" (16.51mm) | 0.650" (16.51mm) | - | BGA | Thermal Tape, Adhesive (Not Included) | 0.400" (10.16mm) | 2.0W @ 40°C | 25.00°C/W @ 350 LFM | - |
